The hottest single chip to overcome the challenge

2022-07-27
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Single glass chip optocpllt to overcome the challenge of optical fiber to silicon photonic integrated circuit coupling on December 7, optoscribe Ltd, the world's leading manufacturer of 3D glass based integrated optical components, announced the launch of optocpllt?, This is a monolithic glass chip for low loss coupling with Silicon Photonics (siph) grating coupler

OptoCplrLT? It aims to overcome the challenges of fiber to silicon photonic integrated circuit (PIC) coupling to achieve mass automated assembly and help reduce costs. OptoCplrLT? Effective reduction of experimental force error under small load adopts optoscribe's proprietary high-speed laser writing technology, which is characterized by a unique low loss optical turning mirror formed in the glass, which can guide light to or from the siph grating coupler. This avoids the need for bend resistant fiber solutions, which are often expensive, challenging, and have some significant limitations in size and shape

to help solve the challenge of floor space, optocplrlt? It has a low profile interface with a height of less than 1.5mm, which can realize a compact interface layout, thus reducing the packaging constraints. It is also compatible with industry standard materials and processes; For example, the coefficient of thermal expansion of a glass chip matches that of a silicon chip, helping to maximize performance. Said Russell childs, CEO of optoscribe. "As data center operators and transceiver manufacturers seek innovative solutions to help solve the challenges of fiber to siph pic coupling, we are pleased to launch optoc, which releases oil into plrlt?, to help meet the market demand for performance, cost and volume, and to help overcome obstacles including siph transceiver packaging and integration."

earlier this year, optoscribe launched optoarray?, This is a new series of its best in class precision optical fiber alignment structures, which can solve many challenges brought by high-density optical connection. OptoArray? At present, it has carried out mass production with a major manufacturer in the optical switch market, and has won the favor of other major customers in the optical cross connect (OXC) switch, wavelength selective switch (WSS) and optical connector market. OptoArray? The solution can be used in a wide range of applications, including multi fiber connectors, arrays for connecting optical switching hardware such as reconfigurable optical add drop multiplexers (ROADMs), and connecting other free space optical systems. Optoscribe's high-speed laser-induced selective etching process provides complete 3D flexibility for array patterning, and can create high-precision and controllable microstructures in glass. This is a novel two-stage glass microstructuralization process, which uses focused ultrashort pulse laser to induce the patterning of subsurface materials and locate the focus of the laser beam. By quickly scanning h in the glass, the three-dimensional shape that avoids many disadvantages such as the hydraulic system working for a long time, the oil circuit temperature is too high and needs to be cooled, and creates an area to improve the etching speed. In this way, when the substrate is exposed to wet chemical etching, the irradiated area will be etched preferentially

the main difference between laser-induced selective etching and silicon pattern is its adaptability, which is a key factor in a rapidly developing industry. For example, because silicon patterning relies on existing MEMS technology and manufacturing facilities, tools used to manufacture 2D arrays can only produce standard silicon wafer thickness, usually 650 microns thick. Since the two-dimensional array requires a thickness of several millimeters to provide mechanical rigidity and integrity to maintain the position of the fiber, three silicon patterned two-dimensional arrays are usually stacked and bonded together to produce the required thickness. This not only creates additional unnecessary processing steps and costs, but also introduces a potential new stacking misalignment error. In contrast, laser-induced selective etching can be performed on substantially thicker glass substrates, such as 2mm

another important feature that highlights the adaptability of laser-induced selective etching is that the technology can control the hole shape in the whole substrate volume. Freeform 3D control also means that the entrance of the hole can be modified to any desired shape. Although the silicon pattern can produce a horn hole to allow simple fiber insertion, the horn must be a standard size cone shape. Laser induced selective etching can produce curved or tapered flares of different lengths, depending on demand. An important advantage of free 3D control is that it can form a familiar operation process at any angle on the glass surface. It is also a protective hole for the machine, and has the opportunity to minimize the back reflection. These functions cannot be realized by Silicon Graphics

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